工作地点：上海闵行紫竹高新科技园区

西部数据介绍

Digital Corporation (NASDAQ：WDC)西部数据公司

数据的力量无可争议--数据正在缔造一个更前瞻、更高能和更加个人化的世界，在日益推动着更睿智的决策、促成变革性的发现、建立更深层的关系。在西部数据，我们对数据的前景深具信心。凡是在需要撷取、保存、存取和传输数据的领域，我们始终引领业界，致力开发数据潜能。西部数据公司坚持不懈地开发技术、提升解决方案，为用户打造更好的生活。

西部数据公司是全球知名的存储解决方案提供商，我们的工作团队遍布全球，专注于开发数据的可能性。我们推出以数据为中心的解决方案，通过HGST、SanDisk和WD等品牌向全球营销。https://www.wdc.com。

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WD,数十年来，WD一直保持着业界大众市场的技术标准制定者的地位。WD的硬盘已被运用于个人计算器、消费电子产品和数字视频应用，以及外部存储、个人云、和企业存储解决方案组合。WD让世界各地的用户通过联网装置，就可以轻松存储、保护、分享和体验他们的数据内容。欲了解更多有关WD品牌的信息，请访问WD官网。

工作地点：上海闵行紫竹高新科技园区（江川东路388号）

简历发送至staffing_NCG@wdc.com

邮件标题格式：申请职位_姓名_专业_学校名字

申请职位列表地点：上海闵行（江川东路388号）（Staffing_NCG@wdc.com）

职位名称及人数	学历/专业要求
1.Senior Engineer, Product Design Engineering 高级产品设计工程师（闪存研发）	本科，硕士，博士； 通信与信息/电子电气工程/微电子/自动化/电路与系统/电子科学与技术/集成电路工程/集成电路设计/固体电子学/物理电子学等
2.Engineer, Product Design Engineering 产品设计工程师（固件测试方向）	本科，硕士，博士； 通信与信息/电子电气工程/微电子/自动化/电路与系统/电子科学与技术/集成电路工程/集成电路设计/固体电子学/物理电子学等
3.Senior Engineer， SSD System Test Engineering 高级测试工程师(固态硬盘)	本科及硕士； 电子电气工程/集成电路设计/微电子/通信与信息系统/电子科学与技术/电子与通信工程等
4.Senior Engineer, Packaging Engineering 高级封装研发工程师	硕士，博士； 材料科学与工程，高分子材料，物理材料，材料学等
5.Intern 4, Non-Engineering
6.Senior Engineer, Packaging Engineering	硕士，博士; 材料/半导体/微电子
7.Senior Engineer, Analytical & Characterization Engineering高级特征性测试分析工程师（芯片验证方向）	硕士及以上；电子电气工程 /微电子/自动化/电路与系统/电子科学与技术/电子与通信工程/集成电路工程 /集成电路设计/固体电子学/物理电子学等
8.Senior Engineer, Test Engineering(ST) 高级系统软件工程师	本科，硕士，博士；微电子/集成电路工程/电子电气工程/信息与通讯工程/通信与信息/自动化/计算机科学与技术/软件工程/电路与系统/电子科学与技术/计算机系统结构/计算机应用技术/通信与信息系统/固体电子学/物理电子学等
9.Senior Engineer, Packaging Engineering 高级封装研发工程师（核心工程—先进封装设备研发）	硕士，博士； 材料科学与工程，高分子材料，物理材料，材料学等

工作地点：上海闵行紫竹高新科技园区（江川东路388号）

简历发送至staffing_NCG@wdc.com

邮件标题格式：申请职位_姓名_专业_学校名字

1.Senior Engineer, Product Design Engineering高级产品设计工程师（闪存研发）

Responsibilities:

·Be responsible for yield improvement for packaged flash memory in development phase

·Be responsible for electrical failure analysis supporting Package Qualification/Reliability Qualification

·Be responsible to provide correct test program with correct test condition for sample testing that are shipped to customer.

·Providing support to MFG team for issue fix and MP yield improvement;

·Define/Support DOEs for insertion/test time reduction, new screen validation and yield improvement;

·Work with multinational team to complete assigned projects in PDT (product development team) required time.

·Tool development for efficiency improvement for data analysis

Requirements:

·Device physics knowledge;

·Ability to troubleshoot, analyze complex problems, multi-task and meet deadlines;

·Electrical Engineering background with BS/MS degree is a big plus

·Can read program developed by C/C++/Java

·Experience for script tool development for data analysis is a plus.

·Excellent English communication (written and verbal) and interpersonal skills;

·Good teamwork, willing to learn, logical thinking and pressure taken;

2.Engineer, Product Design Engineering产品设计工程师（固件测试方向）

Responsibilities:

·Be responsible for development of testing FW for Nand flash memory and MCU and deliver high quality program with high efficiency.

·Be responsible for Failure analysis, code/product/hardware issue debugging.

·Working with other product line teams on screen development and RMA analysis.

·Support manufacturing department on yield improvement and TTR (test time reduction) and still meet quality goals.

·Innovatively make continuous improvement on test program/process and co-work with other departments effectively.

Requirements:

·Electrical Engineering major with BS/MS degree and have background knowledge on MCU/FW/Nand is plus.

·Familiar with PETE R&R.

·Have knowledge on Nand operation/failure mode/testing.

·Familiar with C/Python, having experience with programming.

·Ability to troubleshoot, analyze problems, multi-task and meet deadlines.

·Excellent English communication (written and verbal) and interpersonal skills

·Good team work, willing to learn, logical thinking and can work under pressure.

3.Senior Engineer， SSD System Test Engineering高级测试工程师(固态硬盘)

Responsibilities:

·In this position, the individual will assist in the debugging and development of NAND KGD, BI and MT test programs for FLASH automated test systems.

·The ability to write correct, clean and well documented programs strictly according to design documents and data sheets.

·Support and improve the full-automated test cell with tester and device handler, developing characterization and evaluation programs for new products and supporting failure analysis with product engineering.

·The individual will also be responsible to co-work with various engineering departments to solve program and product issues.

·When urgent needs arrive, the individual need to meet the deadline as required.

Requirements:

·Bachelor or Master Degree in Electronic, Automation, Computer Science or related major Strong programming skills preferred in Java or C; excellent debugging and trouble shoorting skills

·Proficiency in oscilloscopes, logic analyzers, and multi-meters is a plus.

·Excellent English communication (written and verbal) and interpersonal skills

·Ability to achieve results in a fast changing and demanding working environment

4.Senior Engineer, Packaging Engineering高级封装研发工程师（核心工程—先进封装设备研发）

Responsibilities:

·Process development on Molding, interact Technology, Material & Equipment;

·Interface of process, to communicate the requirement from inner/outer customers;

·Recipe Baseline & design rule maintain;

·Trouble shoot for Molding process;

·Program management for new/upgrade process;

·New Package development, qualification till VM, involve thru process & technology.

Requirements:

·Master Degree;

·Major in Material science / Semiconductor / Polymer / Assembly engineering

·Familiar with Molding Process, Manufacturing flow and Quality control, molding experience is preferred;

·Familiar with tradition semiconductor packaging/Assembly;

·Skill of Static Analysis and Quality control tool;

·Good to have program management skill;

·Good English communication (written and verbal) skills;

·Able to do international travel occasionally;

·Self-motivated, teamwork, hardworking, and be able to work under high pressure.

5.G&A Intern 4, Non-Engineering实习生

Responsibilities:

·invitation letter ,

·sick leave certification ,

·mobility support ,

·maintaince / filling

Requirements:

·Good communication skills in both oral & written English

·Good analytics skill

·Proficient in MS office tools (Word; PowerPoint; Excel…)

·Quick learner and willing to take challenges

·Be a team player

6.Senior Engineer, Packaging Engineering高级封装研发工程师封装制造研发，三维晶圆封装研发

Responsibilities:

·Process development on Molding, interact Technology, Material & Equipment;

·Interface of process, to communicate the requirement from inner/outer customers;

·Recipe Baseline & design rule maintain;

·Trouble shoot for Molding process;

·Program management for new/upgrade process;

·New Package development, qualification till VM, involve thru process & technology.

Requirements:

·Master Degree;

·Major in Material science / Semiconductor / Polymer / Assembly engineering

·Familiar with Molding Process, Manufacturing flow and Quality control, molding experience is preferred;

·Familiar with tradition semiconductor packaging/Assembly;

·Skill of Static Analysis and Quality control tool;

·Good to have program management skill;

·Good English communication (written and verbal) skills;

·Able to do international travel occasionally;

·Self-motivated, teamwork, hardworking, and be able to work under high pressure.

7.Senior Engineer, Analytical & Characterization Engineering高级特征性测试分析工程师（芯片验证方向）

Responsibilities:

·Test development and implementation for testing and characterization of NAND memory on ATE test systems.

·In this role, the individual is responsible for all aspects of test debug and validation, correlation, revision control and test/handler setup.

·Perform characterization of all memory technology and designs for logic/ functionality

·Write special tools to speed up the process of design debug and other activities such as memory qualification failure analysis and yield issue.

·Customize test coverage and define new test strategy for specific customers.

·Provide product-engineering support for solving production yield issues through improvement from design or packaging technology. Design and validate test screens as necessary.

·Organize and monitor projects from inception through delivery. Maintain database of statistical data collection and analysis.

Requirements:

·Require familiarity with common lab equipment such as digital scope, logic analyzer.

·Strong skills of testing program development on ATE, solid skills on Language C++/C#

·Require good written and verbal English.

·Requires BS/MS degree or equivalent with engineering background.

8.Senior Engineer, Test Engineering(ST)高级系统软件工程师

Responsibilities:

·In this position, the individual will assist in the debugging and development of NAND KGD, BI and MT test programs for FLASH automated test systems.

·The ability to write correct, clean and well documented programs strictly according to design documents and data sheets.

·Support and improve the full-automated test cell with tester and device handler, developing characterization and evaluation programs for new products and supporting failure analysis with product engineering.

·The individual will also be responsible to co-work with various engineering departments to solve program and product issues.

·When urgent needs arrive, the individual need to meet the deadline as required.

Requirements:

·Bachelor or Master Degree in Electronic, Automation, Computer Science or related major Strong programming skills preferred in Java or C; excellent debugging and trouble shoorting skills

·Proficiency in oscilloscopes, logic analyzers, and multi-meters is a plus.

·Excellent English communication (written and verbal) and interpersonal skills

·Ability to achieve results in a fast changing and demanding working environment.

9.Senior Engineer, Packaging Engineering高级封装研发工程师（核心工程—先进封装设备研发）

Responsibilities:

·Process development on Molding, interact Technology, Material & Equipment;

·Interface of process, to communicate the requirement from inner/outer customers;

·Recipe Baseline & design rule maintain;

·Trouble shoot for Molding process;

·Program management for new/upgrade process;

·New Package development, qualification till VM, involve thru process & technology.

Requirements:

·Master Degree;

·Major in Material science / Semiconductor / Polymer / Assembly engineering

·Familiar with Molding Process, Manufacturing flow and Quality control, molding experience is preferred;

·Familiar with tradition semiconductor packaging/Assembly;

·Skill of Static Analysis and Quality control tool;

·Good to have program management skill;

·Good English communication (written and verbal) skills;

·Able to do international travel occasionally;

·Self-motivated, teamwork, hardworking, and be able to work under high pressure.

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